hello Skiwee and thanks for following up.
So, now it makes scene. Yet again, from my experience i can tell that if the board is placed vertically in the solution (like in my etching tank), the process is many times faster if you continuously move the board up and down, taking out from the solution and dipping it in again. I do not know why, i can only suspect this: Stiring in general helps to remove the etched copper away from the board and let space for the fecl3 to etch some more underneath. I have noticed that the etching process is accomplished in layers, meaning that the copper is removed layer by layer (one thin layer each time). The bubbles agitate the board and the etched copper is removed, but the bubbles do not really cover the whole area of the board. Instead, of you remove the board, a whole layer of etched copper is removed every time. Again, i am not sure since i am not a chemist and know little about chemistry, but this is what i have observe during my etching jobs.
Regarding the precipitate, your answer helped a lot! Now i have to find a nice way to remove them from the solution. In my old tank that is easy, since after every use i remove the solution from the tank and store it in a glass bottle. But in my new tank, the solution will always remain in the tank. The tank will be the storage as well. -Probably the chemists that i asked were not aware that the fecl has solubility 100%. -
(((Sadly, i cannot open the attached document. It seems that my ISP IP is banned since i get 403 forbidden messages. Can you upload this document for me please?)))
Finally, regarding the new tank size: No i certainly do not need that big tank for big PCBs. But i want it for 2 reasons: First, i want the tank to have a lot of fecl solution so that the solution will last longer for more etching jobs, and second, i want the tank to be big so that i can etch multiple PCBs at once.