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Author Topic: The questions about the layout, vias and line width of 4 layer board BGA256 pack  (Read 2565 times)

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whlm

  • Cadet
  • Posts: 1
BGA256 packaging film (17*17 bottom pad pitch 1mm)

Because this is my first time to draw 4 layer board, there are still something unsure.

1.the BGA film is just the FPGA, I used AD software in the PCB library, the pad is a round with a diameter of 19.685mil.  Q: Is it right not to be smaller?  I see some places with 15Mil.

2.What the diameter of the bottom drills it should be? What I choose are 12 mil drill dimmater, 20 mil outer diamater, are they suitable?

3.what about the width line from pads to drill?